Dito Sama DS653567 8x8mm Dicing Grid for Semiconductor Wafer Cutting | Precision Lab Equipment for Microelectronics Manufacturing
Dito Sama DS653567 8x8mm Dicing Grid for Semiconductor Wafer Cutting | Precision Lab Equipment for Microelectronics Manufacturing

Dito Sama DS653567 8x8mm Dicing Grid for Semiconductor Wafer Cutting | Precision Lab Equipment for Microelectronics Manufacturing

$302.5 $550 -45%
Size:8X8mm Depth
8X8mm Depth

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Estimated Delivery:7-15 days international

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SKU:28371417

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Product Description

Dicing grid 8x8 mm - DS653567

Details: 8x8 mm

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